| PART |
Description |
Maker |
| 0472490001 |
Camera Socket for Mobile Phone, Top Mount, SMT, Side Contact Type, 8x8
|
Molex Electronics Ltd.
|
| 0472490005 |
Cover for Mobile Phone Camera Socket, 8x8, Top Mount, Side Contact Type, Stainless Steel, Lead free
|
Molex Electronics Ltd.
|
| 0475860001 |
Camera Socket for Mobile Phone, Top Mount, Side Contact, 6.5x6.5 Camera Module
|
Molex Electronics Ltd.
|
| 02-08-1201 |
Crimp Socket Contact; Wire Size (AWG):18-24; Contact Material:Brass; Contact Plating:Gold; Contact Termination:Crimp PHOSPHOR BRONZE, TIN (35) OVER COPPER FINISH, WIRE TERMINAL
|
Molex, Inc.
|
| NE681M13-T3-A |
PCB COPPER CLAD POS 4X61 SIDE
|
Duracell
California Eastern Laboratories
|
| SF7381-5P-G-520 SF7382-5P-G-530 SF6282-5P-G-520 SF |
5 CONTACT(S), COPPER ALLOY, MALE, CIRCULAR CONNECTOR, SOLDER
2 CONTACT(S), COPPER ALLOY, FEMALE, CIRCULAR CONNECTOR, SOLDER
|
SWITCHCRAFT INC
|
| STK12C68-IM STK12C68-L45IM STK12C68-L35IM STK12C68 |
NVRAM (EEPROM Based) NVRAM中（EEPROM的基础
Fuse Holder; Mounting Type:PC Board; Body Material:Thermoplastic; Contact Material:Beryllium Copper; Contact Plating:Tin; Current Rating:3.5A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Series:154
Fuse Holder; Mounting Type:PC Board; Body Material:Thermoplastic; Contact Material:Beryllium Copper; Contact Plating:Tin; Current Rating:1.5A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Series:154
Fuse Holder; Mounting Type:PC Board Surface Mount; Body Material:Thermoplastic; Contact Material:Beryllium Copper; Contact Plating:Tin; Current Rating:1.5A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes
Fuse Holder; Body Material:Thermoplastic; Current Rating:3A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Series:154; Contact Material:Beryllium Copper; Contact Plating:Tin; Mounting Type:PC Board RoHS Compliant: Yes
Fuse Holder; Body Material:Thermoplastic; Current Rating:5A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Series:154; Contact Material:Beryllium Copper; Contact Plating:Tin; Mounting Type:PC Board RoHS Compliant: Yes
FUSE 5A LITTLEFUSE 154005
CMOS nvSRAM 8K x 8 AutoStore Nonvolatile Static RAM Industrial Temperature/Military Screen
|
N.A.
ETC[ETC]
List of Unclassifed Manufacturers
|
| 0522071660 52207-1660 |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Right Angle, ZIF, Top Contact StyleReceptacle, 16 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging
|
Molex Electronics Ltd.
|
| 52745-1897 0527451897 |
0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Top Contact Style 18 Circuits, Lead-free, Gold (Au) Contact Plating, High Barrier Packaging
|
Molex Electronics Ltd.
|
| 0522071260 52207-1260 |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Right Angle, ZIF, Top Contact StyleReceptacle, 12 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging
|
Molex Electronics Ltd.
|
| HLMP-C027-P0000 HLMP-C608-R00DD HLMP-C025-P0002 HL |
0.5mm contact spacing, 1.0mm height, Top contact, Back flip FPC/FFC connectors; HRS No: 580-1225-5 50; Contact Mating Area Plating: Gold
T-1 3/4 (5 mm) AlInGaP Lamp 的T 1 3 / 45毫米）的AlInGaP
T-13/4 (5mm) AlInGaP Lamp 的T 13 / 4mm）的铝铟镓磷化物
|
Taiwan Semiconductor Co., Ltd.
Avago Technologies, Ltd.
|
| SF7W006S1B |
CONTACT COPPER ALLOY
|
Japan Aviation Electronics Industry, Ltd.
|
|
